Influence of thermal process on microstructural and physical properties of ambient pressure dried hydrophobic silica aerogel monoliths

Journal of Sol-Gel Science and Technology

Volumn 62, Issue 2, 2012, Pages 126-133

  Liu, Guangwu ^a   Zhou, Bin ^a   Ni, Xingyuan ^a   Shen, Jun ^a   Wu, Guangming ^a   Du, Ai ^a   Zu, Guoqing ^a  

^a Tongji University   (China)

Author keywords

Silica aerogel monoliths; Sodium silicate; Thermal conductivity; Thermal process

Indexed keywords

AFTER HIGH TEMPERATURE; AMBIENT PRESSURES; CRACK FREE; HEXAMETHYL DISILOXANE; HIGH SURFACE AREA; HYDROPHOBIC SILICA AEROGEL; LOW DENSITY; LOW THERMAL CONDUCTIVITY; MICRO-STRUCTURAL; ROOM TEMPERATURE; SILICA AEROGELS; SODIUM SILICATE; SURFACE AREA; SURFACE MODIFICATION AGENTS; THERMAL CONDUCTIVITY COEFFICIENT; THERMAL PROCESS;

CERENKOV COUNTERS; HYDROPHOBICITY; MONOLITHIC INTEGRATED CIRCUITS; POROSITY; SILICA GEL; SILICON COMPOUNDS;

THERMAL CONDUCTIVITY;

EID: 84862791214     PISSN: 09280707     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10971-012-2694-x     Document Type: Article

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