A 50-MHz fully integrated low-swing buck converter using packaging inductors

IEEE Transactions on Power Electronics

Volumn 27, Issue 10, 2012, Pages 4347-4356

  Ahn, Youngkook ^a   Nam, Hyunseok ^b   Roh, Jeongjin ^a  

^a Hanyang University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Bonding wire; fully integrated dc dc converter; lead frame; low swing gate driver; packaging inductor

Indexed keywords

BONDING WIRES; BUCK CONVERTERS; CMOS PROCESSS; DC-DC CONVERTER DESIGNS; FULL-SWING; FULLY INTEGRATED; GATE DRIVERS; GATE DRIVING; HIGH-FREQUENCY SWITCHING; LEAD FRAME; LOAD CURRENTS; LOW SWING; ON-CHIP PASSIVES; ONCHIP INDUCTORS; PARASITIC INDUCTANCES; Q-FACTORS; SWITCHING OPERATIONS;

CMOS INTEGRATED CIRCUITS; HVDC POWER TRANSMISSION; INTEGRATION; SWITCHING CIRCUITS; WIRE;

DC-DC CONVERTERS;

EID: 84862004184     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2012.2192136     Document Type: Article

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