Finite element modeling and analysis of surface acoustic wave devices in CMOS technology

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 6, 2012, Pages 1021-1029

  Tigli, Onur ^a,b   Zaghloul, Mona Elwakkad ^c  

^a UNIVERSITY OF MIAMI   (United States)

^b UNIVERSITY OF MIAMI MILLER SCHOOL OF MEDICINE   (United States)

^c George Washington University   (United States)

Author keywords

Complementary metal oxide semiconductor; finite element modeling; microelectromechanical devices; surface acoustic wave

Indexed keywords

3D MODELS; ACCURATE DESIGN; ACOUSTIC BEHAVIOR; ACOUSTOELECTRIC INTERACTION; CMOS TECHNOLOGY; COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR TECHNOLOGIES; EXPERIMENTAL CHARACTERIZATION; FE ANALYSIS; FE-SIMULATION; FINITE ELEMENT MODELING; INDUCED VOLTAGES; OPERATING FREQUENCY; OPERATION FREQUENCY; PERFORMANCE ANALYSIS; PHASE RESPONSE; REJECTION BANDWIDTH; SAW DEVICE; STRAIN MAPS; SURFACE ACOUSTIC WAVES; TOOLSETS; TRANSIENT SIMULATION; WAVE CHARACTERISTICS; ZNO;

ACOUSTIC SURFACE WAVE DEVICES; ACOUSTIC WAVES; ACOUSTOELECTRIC EFFECTS; CMOS INTEGRATED CIRCUITS; DIELECTRIC DEVICES; MICROELECTROMECHANICAL DEVICES; PARAMETER EXTRACTION; THREE DIMENSIONAL; ZINC OXIDE;

FINITE ELEMENT METHOD;

EID: 84861954230     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2170572     Document Type: Article

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