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Volumn 48, Issue 3, 2012, Pages 172-174
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Lifetime enhancement of high-power light-emitting diodes using thermal paths in ceramic package
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Author keywords
[No Author keywords available]
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Indexed keywords
ACCELERATED LIFE TESTS;
ATMOSPHERE TEMPERATURE;
CERAMIC PACKAGE;
GAN-BASED LIGHT-EMITTING DIODES;
HIGH POWER LIGHT EMITTING DIODES;
JUNCTION TEMPERATURES;
LIFETIME ENHANCEMENT;
LOW-TEMPERATURE CO-FIRED CERAMICS;
MEAN TIME TO FAILURE;
TEMPERATURE STRESS;
THERMAL PATHS;
GALLIUM NITRIDE;
TESTING;
LIGHT EMITTING DIODES;
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EID: 84861588801
PISSN: 00135194
EISSN: None
Source Type: Journal
DOI: 10.1049/el.2011.3855 Document Type: Article |
Times cited : (8)
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References (4)
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