Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes

Microelectronics Reliability

Volumn 52, Issue 6, 2012, Pages 1099-1104

  Medjahed, Hassen ^a   Vidal, Paul Etienne ^a   Nogarede, Bertrand ^b  

^a UNIVERSITÉ DE TOULOUSE   (France)

^b CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

3D FINITE ELEMENT MODEL; ACTIVE CURRENT; BONDED WIRES; CURRENT FLOWS; DIRECT CURRENT; ELECTRO-THERMAL STRESS; EXPERIMENTAL TEST; GEOMETRIC PARAMETER; GLOBAL SIMULATION; HIGH POWER MODULE; INFRARED SYSTEMS; LOCAL HEATING; MAIN PROCESS; MECHANICAL STRESS; STEADY AND TRANSIENT; THERMO-MECHANICAL STRESS;

MAGNETIC MATERIALS; MICROELECTRONICS;

THERMAL STRESS;

EID: 84861528075     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.01.013     Document Type: Article

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