Fine-resolution patterning of copper nanoparticles through electrohydrodynamic jet printing

Journal of Micromechanics and Microengineering

Volumn 22, Issue 6, 2012, Pages

  Rahman, Khalid ^a   Khan, Arshad ^a   Muhammad, Nauman Malik ^a   Jo, Jeongdai ^b   Choi, Kyung Hyun ^a  

^a Jeju National University   (South Korea)

^b Korea Institute of Machine and Materials   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

APPLIED VOLTAGES; COLLOIDAL SOLUTIONS; CONDUCTIVE COPPER; COPPER NANOPARTICLES; COPPER TRACKS; CURRENT VOLTAGE; JET DIAMETER; JET PRINTING; OHMIC BEHAVIOR; OPERATING CONDITION; PRINTING TECHNOLOGIES; SILICON SUBSTRATES; SINTERING PROCESS;

ATOMIC FORCE MICROSCOPY; COPPER; ELECTROHYDRODYNAMICS; METAL NANOPARTICLES; SCANNING ELECTRON MICROSCOPY; SINTERING; X RAY DIFFRACTION;

PRINTING;

EID: 84861416448     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/22/6/065012     Document Type: Article

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