Study on the curing process for carbon/epoxy composites to reduce thermal residual stress

Composites Part A: Applied Science and Manufacturing

Volumn 43, Issue 8, 2012, Pages 1197-1202

  Kim, Seong Su ^a   Murayama, Hideaki ^b   Kageyama, Kazuro ^b   Uzawa, Kiyoshi ^b   Kanai, Makoto ^b  

^a Chonbuk National University   (South Korea)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

A. Polymer matrix composites (PMCs); B. Cure behavior; B. Residual stress; D. Process monitoring

Indexed keywords

CARBON/EPOXY COMPOSITES; COMPOSITE SPECIMENS; CURE BEHAVIOR; CURE CYCLE; CURE MONITORING; CURING PROCESS; DIELECTROMETRY; DISSIPATION FACTORS; EMBEDDED FBG; FIBER BRAGG GRATING SENSORS; INTERNAL STRAINS; POLYMERMATRIX COMPOSITES (PMCS); THERMAL RESIDUAL STRESS; THREE-POINT BENDING TEST;

CARBON FIBERS; CURING; FIBER BRAGG GRATINGS; POLYMER MATRIX COMPOSITES; PROCESS MONITORING; STRAIN;

RESIDUAL STRESSES;

EID: 84861335024     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2012.02.023     Document Type: Article

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