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Volumn 88, Issue 4-6, 2012, Pages 418-434

Epoxy composite reinforced with nano and micro SiC particles: Curing kinetics and mechanical properties

Author keywords

Cure behavior; Mechanical properties; Silicon carbide; Thermosetting resin

Indexed keywords

ANTI-WEAR; CURE BEHAVIOR; CURING KINETICS; DYNAMIC MECHANICAL THERMAL ANALYSIS; EPOXY COMPOSITE; EPOXY CURING; FRICTION COEFFICIENTS; HARD PARTICLES; NANOMETRIC PARTICLES; PARTICLE ADDITION; REACTION ORDERS; SIC PARTICLES;

EID: 84861169881     PISSN: 00218464     EISSN: 15455823     Source Type: Journal    
DOI: 10.1080/00218464.2012.660396     Document Type: Conference Paper
Times cited : (66)

References (32)
  • 5
    • 0001453457 scopus 로고    scopus 로고
    • Epoxy-clay nanocomposites
    • T. J. Pinnavaia and W. Beall (Eds.), (JohnWiley, New York, Ch. 7
    • Wang, Z., Massam, J., and Pinnavaia, T. J., "Epoxy-clay nanocomposites," in Polymer-clay nanocomposites, T. J. Pinnavaia and W. Beall (Eds.), (John Wiley, New York, 2001) Ch. 7.
    • (2001) Polymer-Clay Nanocomposites
    • Wang, Z.1    Massam, J.2    Pinnavaia, T.J.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.