Unambiguous identification of the role of a single Cu atom in the ZnO structured green band

Journal of Physics Condensed Matter

Volumn 24, Issue 21, 2012, Pages

  Byrne, D ^a   Herklotz, F ^b   Henry, M O ^a   McGlynn, E ^a  

^a DUBLIN CITY UNIVERSITY   (Ireland)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CU ATOMS; DEFECT EMISSION; GREEN BAND; HIGH QUALITY; LOW TEMPERATURES; WET CHEMICALS; ZERO PHONON LINES; ZNO;

ISOTOPES; SUBSTITUTION REACTIONS;

ZINC OXIDE;

COPPER; NANOMATERIAL; ZINC OXIDE;

ARTICLE; CHEMICAL MODEL; CHEMISTRY; COLOR; COMPUTER SIMULATION; ULTRASTRUCTURE;

COLOR; COMPUTER SIMULATION; COPPER; MODELS, CHEMICAL; NANOSTRUCTURES; ZINC OXIDE;

EID: 84861157538     PISSN: 09538984     EISSN: 1361648X     Source Type: Journal    
DOI: 10.1088/0953-8984/24/21/215802     Document Type: Article

References (22)

1. Klingshirn C 2007 ChemPhysChem 8 782803
2. Solbrig C 1968 Z. Phys. A 211 42951
3. Dingle R 1968 Bull. Am. Phys. Soc. 13 1476
4. Dingle R 1969 Phys. Rev. Lett. 23 579
5. Dingle R 1970 Bull. Am. Phys. Soc. 15 280
6. Dietz R E, Kamimura H, Sturge M D and Yariv A 1963 Phys. Rev. 132 155969
7. Ozgur U, Alivov Y I, Liu C, Teke A, Reshchikov M A, Dogan S, Avrutin V, Cho S J and Morkoc H 2005 J. Appl. Phys. 98 041301 (Pubitemid 41348664)
8. Morkoç H and Özgür Ü 2009 Zinc Oxide: Fundamentals, Materials and Device Technology. Zinc Oxide (Weinheim: WileyVCH)
9. Broser I J, Germer R K F, Schulz H-J E and Wisznewski K P 1978 Solid-State Electron. 21 1597602
10. Heine V and Henry C H 1975 Phys. Rev. B 11 3795803
11. Van Vechten J A 1976 Phys. Rev. B 13 9469
12. Dahan P, Fleurov V, Thurian P, Heitz R, Hoffmann A and Broser I 1998 Phys. Rev. B 57 96904
13. Dahan P, Fleurov V, Thurian P, Heitz R, Hoffmann A and Broser I 1998 J. Phys.: Condens. Matter 10 200719
14. TEW Tokyo Denpasar, High quality ZnO substrates for wide bandgap applications. Material data specifications available from TEW Tokyo Denpa http://www.tew.co.jp/e/material/01.html 2011
15. Takahashi H, Nakamura H, Izaki M and Katayama J 2003 Method of forming a Cu interconnect pattern, NEC Corporation, Tokyo, JP, Osaka Municiple Government, Osaka, JP, United States
16. Garces N Y, Wang L, Bai L, Giles N C, Halliburton L E and Cantwell G 2002 Appl. Phys. Lett. 81 6224 (Pubitemid 34923971)
17. Xing G Z, Xing G C, Li M J, Sie E J, Wang D D, Sulistio A, Ye Q L, Huan C H A, Wu T and Sum T C 2011 Appl. Phys. Lett. 98 102105
18. Baumert R, Broser I, Pohl U W and Sange B 1985 J. Phys. C: Solid State Phys. 18 4767
19. Herklotz F, Lavrov E V and Weber J 2009 Physica B 404 48079
20. Qiu H, Gallino F, Di Valentin C and Wang Y 2011 Phys. Rev. Lett. 106 066401
21. Wahl U, Rita E, Correia J G, Agne T, Alves E and Soares J C 2006 Superlatt. Microstruct. 39 22937 (Pubitemid 43005139)
22. Steger M, Yang A, Sekiguchi T, Saeedi K, Thewalt M L W, Henry M O, Johnston K, Riemann H, Abrosimov N V, Churbanov M F, Gusev A V, Kaliteevskii A K, Godisov O N, Becker P and Pohl H J 2011 J. Appl. Phys. 110 081301