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Volumn , Issue , 2011, Pages 000833-000837

Spatial and directional distribution of cracks in silicon PV modules after uniform mechanical loads

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM FRAMES; CRACK DISTRIBUTION; CRACK ORIENTATIONS; CRYSTALLINE SILICONS; DIRECTIONAL DISTRIBUTIONS; ELECTRICAL SEPARATION; MECHANICAL LOADS; POTENTIAL RISKS; POWER OUT PUT; PRINCIPAL STRAIN; PV MODULES; STRAIN ANALYSIS; STRAIN DISTRIBUTIONS; SUBSEQUENT REDUCTION;

EID: 84861022575     PISSN: 01608371     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PVSC.2011.6186082     Document Type: Conference Paper
Times cited : (18)

References (7)
  • 2
    • 79951851652 scopus 로고    scopus 로고
    • The Link between Mechanical Stress Induced by Soldering and Micro Damages in Silicon Solar Cells
    • J. Wendt, M. Träger, M. Mette, A. Pfennig, B. Jäckel, "The Link Between Mechanical Stress Induced by Soldering and Micro Damages in Silicon Solar Cells", Proc. of 24th EUPVSEC, 2009, pp. 3420-3423
    • (2009) Proc. of 24th EUPVSEC , pp. 3420-3423
    • Wendt, J.1    Träger, M.2    Mette, M.3    Pfennig, A.4    Jäckel, B.5
  • 3
    • 84861061830 scopus 로고    scopus 로고
    • The Impact of Dynamic Loads on Crystalline PV Modules of Different Wafer Thickness Imaged by Electroluminescence
    • 4CO.2.2
    • U. Jahn, F. Reil & T. Bernert, The Impact of Dynamic Loads on Crystalline PV Modules of Different Wafer Thickness Imaged by Electroluminescence, Proc. of 23rd EUPVSEC, 2009, 4CO.2.2
    • (2009) Proc. of 23rd EUPVSEC
    • Jahn, U.1    Reil, F.2    Bernert, T.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.