Direct printing of circuit boards using Aerosol Jet®

International Conference on Digital Printing Technologies

Volumn , Issue , 2011, Pages 433-436

  Christenson, Kurt K ^a   Paulsen, Jason A ^a   Renn, Michael J ^a   McDonald, Kelley ^a   Bourassa, Justin ^a  

^a Optomec   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D GEOMETRY; ACTIVE COMPONENTS; ACTIVE DEVICES; AUTOMATED GENERATION; CARBON-BASED; CIRCUIT BOARDS; COST-EFFECTIVE METHODS; DIRECT PRINTING; IC CHIPS; METALLIC WIRE; MULTILAYER CIRCUITS; NON-TRADITIONAL; PARALLEL PLATE CAPACITORS; PASSIVE COMPONENTS; PICK AND PLACE; POLYMERIC INSULATORS; PRINTED PATTERNS; PROCESSING TEMPERATURE; TOOLPATHS; WIRE BONDING;

ATMOSPHERIC AEROSOLS; CAPACITORS; COMPUTER AIDED DESIGN; FABRICATION; RESISTORS; SUBSTRATES;

PRINTED CIRCUIT BOARDS;

EID: 84860747477     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. F. Bibelriether et al., Print the Printed Circuit Board - Inkjet Printing of Electronic Devices, Proc. NIP26, pg. 715. (2010).
2. N. Marjanovic et al., Digital Fabrication of - Oxide Electronics, Proc. NIP26, pg. 720. (2010).
3. D. Mager et al., On-Line Monitoring and Feedback Control of Inkjet Printed Capacitors Using the Modular Custom Made Printing Platform Microstack3D, Proc. NIP26, pg. 726. (2010).
4. Eagle PCB layout software information available at: http://www. cadsoftusa.com
5. Aerosol Jet technology information available at: http://www.optomec.com
6. M. Ha et al., "Printed, Sub-3V Digital Circuits on Plastic from Aqueous Carbon Nanotube Inks," ACSNano, 4, 4388 (2010).
7. M. O'Reilly and J. Leal, "Jetting Your Way to Fine-Pitch 3-D Interconnects," Chip-Scale Review, 14, 18, (2010).