A modular 1mm 3 die-stacked sensing platform with optical communication and multi-modal energy harvesting

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn 55, Issue , 2012, Pages 402-403

  Lee, Yoonmyung ^a   Kim, Gyouho ^a   Bang, Suyoung ^a   Kim, Yejoong ^a   Lee, Inhee ^a   Dutta, Prabal ^a   Sylvester, Dennis ^a   Blaauw, David ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROPRIATE TECHNOLOGIES; END-USERS; FLEXIBLE DESIGNS; HETEROGENEOUS SENSORS; IMPLANTABLE MICROSYSTEMS; INTER-LAYER COMMUNICATION; MEDICAL IMPLANTS; MULTI-MODAL; MULTILAYER STRUCTURES; MULTIPLE APPLICATIONS; POWER MANAGEMENT UNIT; PRACTICAL ISSUES; RE-PROGRAMMING; SCALE SYSTEM; SENSING PLATFORMS; SMART DUST; SURVEILLANCE SYSTEMS; SYSTEM ASSEMBLY; TIME-PERIODS; ULTRA-LOW POWER; WAKE-UP RECEIVER; WIRELESS SENSOR NODE;

DUST; ELECTRIC NETWORK SYNTHESIS; ENERGY HARVESTING; ENERGY MANAGEMENT; MEDICAL APPLICATIONS; OPTICAL COMMUNICATION; SENSOR NODES;

LOW POWER ELECTRONICS;

EID: 84860671642     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2012.6177065     Document Type: Conference Paper

References (6)

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