Micromachining 3D hemispherical features in silicon via micro-EDM

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2012, Pages 289-292

  Chan, Mei Lin ^a   Fonda, P ^a   Reyes, C ^a   Xie, J ^b   Najar, H ^a   Lin, L ^b   Yamazaki, K ^a   Horsley, D A ^a  

^a University of California   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D SHAPE; AXISYMMETRIC; HEMISPHERICAL STRUCTURE; HIGH THROUGHPUT; MICRO EDM; MICRO ELECTRICAL DISCHARGE MACHINING; POLYCRYSTALLINE DIAMONDS; SHELL STRUCTURE; SILICON MICROFABRICATION; TOOL WEAR; TOTAL PROCESSING TIME;

COMPOSITE MICROMECHANICS; MEMS; THREE DIMENSIONAL;

MICROMACHINING;

EID: 84860452606     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2012.6170151     Document Type: Conference Paper

References (7)

1. T. Masaki, K. Kawata and T. Masuzawa, Proc. IEEE., Transducers 1990, pp 21-26.
2. D. Reynaerts, P.H. Heeren, H.V. Brussel, Sensors and Actuators A, Vol. 60, 1997, pp. 212-218.
3. G. Staufert, A. Dommann and D. Läuger, J. Micromech Microeng., Vol. 3, 1993, pp.232-235
4. C.L. Fegely, D.N. Hutchison, S.A. Bhave, Proc. IEEE Transducers 2011, pp 2595-2598.
5. Hisayoshi Hashimoto, Shinji Tanaka, Kazuo Sato, Isao Ishikawa, Sigeo Kato and Noriyoshi Chubachi, J.J. Appl. Phys., 32(1993), pp. 2543-2546.
6. S. Suzuki and A. Sharma, Key Eng. Mat., Vol. 291-292, 2005, pp. 549-554.
7. E. Uhlmann and M. Roehner, CIRP J. Manufacturing Science and Technology, Vol. 1, 2008, pp. 92-96.