Microstructures and toughening mechanisms of organoclay/polyethersulphone/epoxy hybrid nanocomposites

Materials Science and Engineering: A

Volumn 528, Issue 27, 2011, Pages 7999-8005

  Wang, Yang ^a   Zhang, Boming ^a   Ye, Jinrui ^a  

^a BEIHANG UNIVERSITY   (China)

Author keywords

Fracture toughness; Hybrid nanocomposites; Organoclay; Toughening mechanism

Indexed keywords

AGGLOMERATION; CRACKS; EPOXY RESINS; MICROSTRUCTURE; NANOCOMPOSITES; ORGANOCLAY; PLASTIC DEFORMATION;

EPOXY; HYBRID NANOCOMPOSITES; MATRIX; MICRON SCALE; MICROSTRUCTURE MECHANISM; NANO LAYERS; ORGANOCLAYS; POLY(ETHER SULFONE); POLYETHER SULFONE; TOUGHENING MECHANISMS;

FRACTURE TOUGHNESS;

EID: 84860417496     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.07.009     Document Type: Article

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