CHARACTERISATION OF OPEN-CELL ALUMINUM ALLOY FOAMS AS HEAT SINKS FOR HIGH POWER ELECTRONIC DEVICES

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1997-M, Issue , 1997, Pages 1-6

  Bastawros, A F ^a   Evans, A G ^a  

^a HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR; ALUMINUM ALLOYS; ELECTRIC POWER SYSTEMS; FLOW OF FLUIDS; HEAT TRANSFER;

AIR VELOCITIES; AL-ALLOY; ALUMINUM ALLOY FOAMS; CELL WALLS; CELL-MATERIALS; FOAM MORPHOLOGY; HEAT TRANSFER CO-EFFICIENTS; HIGH-POWER ELECTRONIC DEVICES; OPEN-CELL; SILICON SUBSTRATES;

HEAT SINKS;

EID: 84859787770     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1997-1208     Document Type: Conference Paper

References (15)

1. Bar-Cohen, A. and Kraus, A. D. (Eds.), 1988, Advances in Thermal Modeling of Electronic Components and Systems, Vol. I, Hemisphere, New York.
2. Bastawros, A. -F. and Kim, K. -S, 1995, "Electro-Thermal Crack Growth Caused by Electric-Current Intensification," Proceedings, ASME meeting, EEP-11, pp. 238-244.
3. Bastawros, A. -F. and Evans, A. G., 1997, work in progress.
4. Bejan, A., 1995, Convection Heat Transfer, John Wiley & Sons Inc., New York.
5. Christou, A., 1994, Electromigration &Electronic Device Degradation, John Wiley & Sons Inc., New York.
6. Dybbs, A. and Edwards, R. V., 1984, “A New Look at Porous Media Fluid Mechanics-Darcy to Turbulent,” In Fundamentals ofTransportPhenomena in Porous Media, Bear and Corapcioglu, eds., Martinus Nijhoff Publishers, pp. 199-254.
7. Hall, M. J. and Hiatt, J. P., 1994, “Exit Flows from Highly Porous Media,” Physics of Fluids, Vol. 6, pp.469-479.
8. Holman, J. P., 1986, Heat Transfer, McGraw-Hill Inc., New York.
9. Jolis, K. R. and Hanratty, T. J., 1966, “Transition to Turbulence for Flow Through a Dumped Bed of Spheres,” Chemi. Engng. Sci., Vol. 21, pp. 1185-1190.
10. Kaviany, M. 1995, Principles of Heat Transfer in Porous Media, Springer-Verlag Inc., New York.
11. Lu, T. J. and Ashby, M. F. 1997, “Heat Dissipation in Metal Foams with Open Cells,” Manuscript in preparation.
12. Lu, T. J., Hutchinson J. W. and Evans A. G., 1996, “The Effects of Material Properties on Heat Dissipation in High Power electronics,” Technical Report Mech-285, Harvard Univ., Cambridge, MA.
13. Nakayama, W., 1986, “Thermal Management of Electronic Equipment: A Review of Technology and Research Topics,” Applied Mechanics review. Vol. 39, pp.1847-1868.
14. Riiegsegger, P., Koller, B. and Muller, R., 1996, “A Microtomographic System for the Nondestructive Evaluation of Bone Architecture,” Calcified Tissue International, Vol. 58, pp. 24-29.
15. Zukauskas, A., 1972, “Heat Transfer from Tubes in Cross Flow,” Adv. Heat Transfer, Vol. 8, pp. 93-160.