Experimental analysis of two dimensional photoelastic properties used in fracture mechanics

Journal of the Institution of Engineers (India): Mechanical Engineering Division

Volumn 91, Issue APRIL, 2010, Pages 21-24

  Misra, A ^a   Singh, V K ^a  

^a G B PANT UNIVERSITY OF AGRICULTURE AND TECHNOLOGY   (India)

Author keywords

Optamechanical properties; Photo elasticity

Indexed keywords

ACCURATE MEASUREMENT; DATA COLLECTION; EXPERIMENTAL ANALYSIS; EXPERIMENTAL STUDIES; FIGURE OF MERITS; FRACTURE ANALYSIS; ISOCHROMATIC FRINGES; MATERIAL BEHAVIOR; OPTAMECHANICAL PROPERTIES; OPTOMECHANICAL; PHOTOELASTIC MATERIALS; PHOTOELASTIC MODELS; POLYAMINES; SENSITIVITY INDICES; STATIC AND DYNAMIC LOADING; STRESS-STRAIN; STRESS-STRAIN ANALYSIS;

DYNAMIC LOADS; EPOXY RESINS; FRACTURE MECHANICS; IMAGE PROCESSING; MECHANICAL PROPERTIES; OPTICAL DATA PROCESSING; REFRACTIVE INDEX;

MATERIALS;

EID: 84859564372     PISSN: 00203408     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (10)

1. S Singh. 'Experimental Stress Analysis'. Khanna Publishers, Delhi. India, 1990.
2. S N Atluri and A S Kobayashi. 'Mechanical Response of Materials'. Handbook on Experimental Mechanics, Prentice-Hall. 1993, p 1037.
3. J Schrade. 'The Epoxy Resins'. McGraw Hill, New York, 1967.
4. C A May and Y Tanaka. 'Epoxy Resines Chemistry and Technology'. Marcel Dekker, 1973.
5. A W Henry. 'Photoelastic Analysis'. Pergamon Press London 1st Ed, 1966.
6. M M Frocht. 'Photoelasticity'. Pegamon Press, New York, 1963.
7. W E Brown. 'Testing of Polymers'. Interscience Publishers, vol 4, 1968.
8. A Misra. 'Research Report on Some Properties of Cast Epoxy Resins Funded by Directorate vof Experiment Station'. Pantnagar University, Sept 1993.
9. V K Singh. 'Thesis, Experimental Investigation of Mixed Mode Stress Field Parameters under Biaxial Loading Condition'. G B. Pant University of Ag & Technology, Pantnagar, 2002
10. C W Smith. 'Use of Three Dimensional Photoelasticity in Fracture Mechanics'. Experimental Mechanics, vol 13, no 12, 1973, p 539.