Novel coupling and packaging approaches for optical interconnects

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 8267, Issue , 2012, Pages

  Van Hoe, B ^a   Bosman, E ^a   Missinne, J ^a   Kalathimekkad, S ^a   Van Steenberge, G ^a   Van Daele, P ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

Coupling; Flexible package; Integration; Micromirror; Optical interconnect; Polymer waveguide; Stretchable waveguide

Indexed keywords

CHIP EMBEDDED; COUPLING LOSS; COUPLING SCHEME; FABRICATION TECHNOLOGIES; FLEXIBLE PACKAGES; FLEXIBLE POLYMERS; MICRO MIRROR; MICROVIAS; MULTIMODE POLYMERS; OPTICAL INTERCONNECT; OPTOELECTRONIC PACKAGES; POLYMER MATERIALS; POLYMER WAVEGUIDE; THIN-FILM DEPOSITIONS; ULTRA-THIN; WAVEGUIDE STRUCTURE; WAVEGUIDING STRUCTURES;

COUPLINGS; ELECTRIC POWER SYSTEM INTERCONNECTION; INTEGRATION; OPTICAL FIBER FABRICATION; OPTICAL FIBERS; POLYMERS; SURFACE EMITTING LASERS; WAVEGUIDE COMPONENTS;

OPTICAL INTERCONNECTS;

EID: 84858684832     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.913760     Document Type: Conference Paper

References (7)

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