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Volumn , Issue , 2006, Pages

High-temperature adhesive development

Author keywords

Adhesives adhesive bonding; High temperature composite materials structures; Resins materials Polyimide (PI)

Indexed keywords

ADHESIVE BONDING; HIGH-TEMPERATURE ADHESIVE SYSTEM;

EID: 84858462981     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (1)

References (2)
  • 1
    • 0012429652 scopus 로고    scopus 로고
    • E.M. Petrie, ed, McGraw-Hill
    • Handbook of Adhesives and Sealants, E.M. Petrie, ed., McGraw-Hill (2000) pp. 615-682.
    • (2000) Handbook of Adhesives and Sealants , pp. 615-682
  • 2
    • 36448929924 scopus 로고    scopus 로고
    • High-Temple Workshop XXIII, D. McCray et.al. Evaluation of High-Temp. Adhesive Bondings Process for Rocket Engine Combustion Chamber Applications, 2003.
    • High-Temple Workshop XXIII, D. McCray et.al. "Evaluation of High-Temp. Adhesive Bondings Process for Rocket Engine Combustion Chamber Applications, 2003.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.