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Volumn , Issue , 2006, Pages
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High-temperature adhesive development
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Author keywords
Adhesives adhesive bonding; High temperature composite materials structures; Resins materials Polyimide (PI)
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Indexed keywords
ADHESIVE BONDING;
HIGH-TEMPERATURE ADHESIVE SYSTEM;
ADHESIVES;
AIRCRAFT ENGINES;
CHEMICAL INDUSTRY;
COMPOSITE MATERIALS;
DURABILITY;
JET ENGINES;
MILITARY VEHICLES;
POLYIMIDES;
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EID: 84858462981
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (1)
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References (2)
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