Creep measurements of 200 μm - 400 μm solder joints

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Volumn , Issue , 2007, Pages

  Röllig, Mike ^a   Wiese, Steffen ^a   Meier, Karsten ^a   Wolter, Klaus Jürgen ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP MEASUREMENTS; REFLOW COOLING RATE; SOLDER MATERIALS;

COOLING; CREEP; ELECTRONIC EQUIPMENT; METALLIZING; MICROSTRUCTURE; SOLDERING ALLOYS;

SOLDERED JOINTS;

EID: 84858460949     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.359938     Document Type: Conference Paper

References (11)

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