Effect of thermal residual stresses on the apparent interfacial toughness of epoxy/aluminum interface

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 333-336

  Yao, Qizhou ^a   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINUM; BENDING TESTS; CRACKS; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); RESIDUAL STRESSES; SILICA; THERMAL EXPANSION;

ALUMINUM SUBSTRATE; APPARENT FRACTURE TOUGHNESS; COHESIVE FAILURES; EPOXY/ALUMINUM INTERFACES; FOUR-POINT BENDING TEST; INTERFACIAL CRACKS; INTERFACIAL TOUGHNESS; THERMAL RESIDUAL STRESS;

PACKAGING MATERIALS;

EID: 84858296800     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757334     Document Type: Conference Paper

References (12)

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