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Volumn , Issue , 2011, Pages

Monolithic flip-chip compatible twin-IQ mach-zehnder modulators for hybrid assembly onto high capacity optical transmitter boards

Author keywords

[No Author keywords available]

Indexed keywords

BASIC BUILDING BLOCK; CHIP ALIGNMENT; DATA CHIP; FLIP CHIP; FLIP-CHIP BONDING; HIGH CAPACITY; HYBRID ASSEMBLY; LOW LOSS; MACH ZEHNDER MODULATOR; MODULATOR CHIPS; MONOLITHIC DEVICES; ON CHIPS; OPTICAL TRANSMITTERS; SMALL-SIGNAL RESPONSE;

EID: 84858234297     PISSN: 10928669     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (7)
  • 1
    • 49349112903 scopus 로고    scopus 로고
    • Hybrid integration technology for high functionality devices in optical communication
    • paper #OWI3
    • G. Maxwell: "Hybrid Integration Technology for High Functionality Devices in Optical Communication", Proc. OFC/NFOEC Conference 2008, paper #OWI3.
    • (2008) Proc. OFC/NFOEC Conference
    • Maxwell, G.1
  • 4
    • 84858198205 scopus 로고    scopus 로고
    • www.cogooptronics.com.
  • 5
    • 0037142529 scopus 로고    scopus 로고
    • Ultra-wideband (from DC to 110 GHz) CPW to CPS transition
    • DOI 10.1049/el:20020423
    • S. Kim, S. Jeong, Y.-T Lee, D.-H. Kim, J.-S. Lim, K.-S. Seo, S. Nam: "Ultra-wideband (from DC to 110 GHz) CPW to CS transition", Electronic Letters, vol. 38, no. 13, 2002, pp. 622-623. (Pubitemid 34725598)
    • (2002) Electronics Letters , vol.38 , Issue.13 , pp. 622-623
    • Kim, S.1    Jeong, S.2    Lee, Y.-T.3    Kim, D.-H.4    Lim, J.-S.5    Seo, K.-S.6    Nam, S.7


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.