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Volumn , Issue , 2011, Pages
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Monolithic flip-chip compatible twin-IQ mach-zehnder modulators for hybrid assembly onto high capacity optical transmitter boards
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Author keywords
[No Author keywords available]
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Indexed keywords
BASIC BUILDING BLOCK;
CHIP ALIGNMENT;
DATA CHIP;
FLIP CHIP;
FLIP-CHIP BONDING;
HIGH CAPACITY;
HYBRID ASSEMBLY;
LOW LOSS;
MACH ZEHNDER MODULATOR;
MODULATOR CHIPS;
MONOLITHIC DEVICES;
ON CHIPS;
OPTICAL TRANSMITTERS;
SMALL-SIGNAL RESPONSE;
BEAM PROPAGATION METHOD;
CHARACTERIZATION;
INDIUM PHOSPHIDE;
LIGHT MODULATORS;
SEMICONDUCTING SILICON;
SILICA;
FLIP CHIP DEVICES;
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EID: 84858234297
PISSN: 10928669
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (7)
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