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Volumn 60, Issue 3 PART 2, 2012, Pages 724-729

Power amplification at 0.65 THz using InP HEMTs

Author keywords

HEMT; millimeter wave; power amplifier; solid state power amplifier (SSPA); sub millimeter wave; terahertz monolithic integrated circuit (TMIC)

Indexed keywords

AMPLIFIER MODULES; BUILDING BLOCKES; DIRECT COUPLING; ELECTROMAGNETIC TRANSITIONS; INP; INP HEMT; OUTPUT POWER; OUTPUT STAGES; PEAK OUTPUT POWER; POWER AMPLIFICATION; SATURATED OUTPUT POWER; SMALL-SIGNAL GAIN; SOLID STATE POWER AMPLIFIER; SUBMILLIMETERS; TERA HERTZ; Y-JUNCTIONS;

EID: 84858153660     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2011.2176503     Document Type: Article
Times cited : (119)

References (12)
  • 2
    • 0036500775 scopus 로고    scopus 로고
    • Terahertz technology
    • Mar
    • P. Siegel, "Terahertz technology," IEEE Trans. Microw. Theory Tech., vol. 50, no. 3, pp. 910-928, Mar. 2002.
    • (2002) IEEE Trans. Microw. Theory Tech. , vol.50 , Issue.3 , pp. 910-928
    • Siegel, P.1
  • 12
    • 80052485541 scopus 로고    scopus 로고
    • THz monolithic integrated circuits using InP high electron mobility transistors
    • Sep
    • W. R. Deal, X. B. Mei, K. Leong, V. Radisic, S. Sarkozy, and R. Lai, "THz monolithic integrated circuits using InP high electron mobility transistors," IEEE Trans. Terahertz Technol., vol. 1, no. 1, pp. 25-32, Sep. 2011.
    • (2011) IEEE Trans. Terahertz Technol. , vol.1 , Issue.1 , pp. 25-32
    • Deal, W.R.1    Mei, X.B.2    Leong, K.3    Radisic, V.4    Sarkozy, S.5    Lai, R.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.