Low loss EELS and EFTEM study of Bi 2Te 3 based bulk and nanomaterials

Materials Research Society Symposium Proceedings

Volumn 1329, Issue , 2011, Pages 41-46

  Peranio, N ^a   Aabdin, Z ^a   Tollner W ^b   Winkler, M ^c   Konig J ^c   Eibl, O ^a   Nielsch, K ^b   Bottner H ^c  

^a UNIVERSITY OF TÜBINGEN   (Germany)

^b UNIVERSITY OF HAMBURG   (Germany)

^c FRAUNHOFER INSTITUTE FOR PHYSICAL MEASUREMENT TECHNIQUES IPM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BI-SB-TE; BLOCKING LAYERS; BULK MATERIALS; ELECTROCHEMICAL DEPOSITION; ELEMENTAL MAPS; ENERGY DISPERSIVE X-RAY; ENERGY FILTERED TRANSMISSION ELECTRON MICROSCOPY; LOW LOSS; MULTI-LAYERED; PLASMON DISPERSION; PLASMON ENERGY; RATIO IMAGES;

DISPERSIONS; ELECTRONIC STRUCTURE; GRAIN BOUNDARIES; MOLECULAR BEAM EPITAXY; NANOSTRUCTURED MATERIALS; NANOWIRES; PLASMONS; REDUCTION; SEMICONDUCTING SELENIUM COMPOUNDS; TELLURIUM; TELLURIUM COMPOUNDS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

ELECTRON ENERGY LOSS SPECTROSCOPY;

EID: 84857452076     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/opl.2011.1238     Document Type: Conference Paper

References (18)

1. L.D. Hicks and M.S. Dresselhaus, Phys. Rev. B 47, 12727 (1993).
2. R. Venkatasubramanian, E. Siivola, T. Colpitts, and B. O'Quinn, Nature (London) 413, 597 (2001).
3. P. Larson, Phys. Rev. B 68, 155121 (2003).
4. German Research Council (DFG), priority program SPP1386 Nanostructured Thermoelectric Materials: Theory, Model Systems and Controlled Synthesis, http://134.100.105.117/
5. N. Peranio and O. Eibl, Phys. Status Solidi A 204, 3243 (2007).
6. P.E. Batson and J. Silcox, Phys. Rev. B 27, 5224 (1983).
7. S. Nakajima, J. Phys. Chem. Solids 24, 479 (1963).
8. Lee, J.; Farhangfar, S.; Lee, J.; Cagnon, L.; Scholz, R.; Gösele, U.; Nielsch, K. Nanotechnology 19, No. 365701 (2008).
9. th International Conference on Thermoelectrics (ICT2007), Jeju Island, Korea, 2007, (IEEE, Piscataway, NJ, USA, 2007), pp. 390-393.
10. th European Conference on Thermoelectrics, Italy, 2010, p. 26.
11. J.D. König, M. Winkler, S. Buller, W. Bensch, U. Schürmann, L. Kienle, H. Böttner, to be published in Journal of Electronic Materials, Special Issue: International Conference on Thermoelectrics 2010, (2011).
12. N. Peranio et al., (unpublished).
13. N. Peranio, O. Eibl, and J. Nurnus, J. Appl. Phys. 100, No. 114306 (2006).
14. N. Peranio and O. Eibl, J. Appl. Phys. 103, No. 024314 (2008).
15. M. Mitome, Y. Yamazaki, H. Takagi, and T. Nakagiri, J. Appl. Phys. 72, 812 (1992).
16. Y.W. Wang, J.S. Kim, G.H. Kim, and K.S. Kim, Appl. Phys. Lett. 88, 143106 (2006).
17. T. Pichler, M. Knupfer, M.S. Golden, J. Fink, A. Rinzler, and R.E. Smalley, Phys. Rev. Lett. 80, 4729 (1998).
18. D.M. Rowe, CRC Handbook of Thermoelectrics (CRC, Boca Raton, FL, 1995), chapter 19.