Analytical approximation for solidification processes in PCM storage with internal fins: Imposed heat flux

Heat and Mass Transfer/Waerme- und Stoffuebertragung

Volumn 47, Issue 4, 2011, Pages 369-376

  Talati, F ^a   Mosaffa, A H ^a   Rosen, M A ^b  

^a UNIVERSITY OF TABRIZ   (Iran)

^b UNIVERSITY OF ONTARIO INSTITUTE OF TECHNOLOGY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL APPROXIMATION; CONSTANT HEAT FLUX; ENTHALPY METHOD; INTERNAL FINS; INTERNAL HEAT TRANSFER; LOW THERMAL CONDUCTIVITY; NUMERICAL APPROACHES; PLATE FINS; SOLID-LIQUID INTERFACES; SOLIDIFICATION PROCESS; THERMAL ENERGY STORAGE SYSTEMS; THERMAL ENERGY SYSTEMS; VERTICAL WALL;

ANALYTICAL MODELS; COMPUTER SIMULATION; COOLING SYSTEMS; FORCED CONVECTION; HEAT FLUX; HEAT STORAGE; MODELS; NUMERICAL METHODS; PHASE CHANGE MATERIALS; SOLIDIFICATION;

FINS (HEAT EXCHANGE);

EID: 84856809485     PISSN: 09477411     EISSN: 14321181     Source Type: Journal    
DOI: 10.1007/s00231-010-0729-9     Document Type: Article

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