Preparation and properties of addition curable silicone resins with excellent dielectric properties and thermal resistance

Polymer Engineering and Science

Volumn 52, Issue 2, 2012, Pages 259-267

  Zhang, Beijing ^a   Zhuo, Dongxian ^a   Gu, Aijuan ^a   Liang, Guozheng ^a   Hu, Jiang Tao ^a   Yuan, Li ^a  

^a SOOCHOW UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIELECTRIC PROPERTIES; MICROELECTRONICS; RESINS; STOICHIOMETRY; THERMAL INSULATION;

DIELECTRICS PROPERTY; FUNCTIONALIZED; GOOD STABILITY; HEXAMETHYL DISILOXANE; HYPERBRANCHED POLYSILOXANES; LOW DIELECTRIC CONSTANTS; PROPERTY; RESIN SYSTEMS; SYNTHESISED; TWO-COMPONENT;

SILICONES;

EID: 84856001880     PISSN: 00323888     EISSN: 15482634     Source Type: Journal    
DOI: 10.1002/pen.22077     Document Type: Article

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