Experimental investigation of enhanced spreading and cooling from a microgrooved surface

Microfluidics and Nanofluidics

Volumn 11, Issue 4, 2011, Pages 489-499

  Kundu, Pranab Kumar ^a   Chakraborty, Suman ^a   DasGupta, Sunando ^b  

^a INDIAN INSTITUTE OF TECHNOLOGY   (India)

^b NONE

Author keywords

Contact angle; Cooling; Film thickness; Microgrooves; Phase change

Indexed keywords

AVERAGE VALUES; BENEFICIAL EFFECTS; BODY FORCES; COOLING PROCESS; ENHANCED COOLING; EXPERIMENTAL INVESTIGATIONS; HEAT INPUT; HEAT SPREADING; HOT REGIONS; IDENTICAL CONDITIONS; IMAGE ANALYZING INTERFEROMETRY; LITHOGRAPHIC PROCESS; MICROGROOVED SURFACE; MICROGROOVES; PASSIVE COOLING; PHASE CHANGE; SILICON SUBSTRATES; TEMPERATURE HOMOGENIZATION; TEMPERATURE PROFILES;

CONTACT ANGLE; COOLING; FILM THICKNESS; MICROFILM; SEMICONDUCTING SILICON COMPOUNDS;

SILICON WAFERS;

EID: 84855951791     PISSN: 16134982     EISSN: 16134990     Source Type: Journal    
DOI: 10.1007/s10404-011-0814-5     Document Type: Article

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