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Volumn , Issue , 2011, Pages 73-76

Thermal analysis and experimental validation on cooling efficiency of thin film transistor liquid crystal display (TFT-LCD) panels

Author keywords

Computational fluid dynamics; FloEFD; TFT LCD TV; Thermal simulation

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS SIMULATIONS; COOLING EFFICIENCY; EXPERIMENTAL VALIDATIONS; FLOEFD; HIGH HEAT FLUX; LONG SERVICE LIFE; TEST DEVICE; TFT-LCDS; THERMAL CAMERA; THERMAL PREDICTION; THERMAL SIMULATIONS; THIN FILM TRANSISTOR LIQUID CRYSTAL DISPLAYS;

EID: 84855775012     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SIITME.2011.6102689     Document Type: Conference Paper
Times cited : (6)

References (6)
  • 3
    • 0028380961 scopus 로고
    • Analysis of beam landing shifts due to thermal deformations of a shadow mask
    • H. Kim, S. Im, "Analysis of beam landing shifts due to thermal deformations of a shadow mask, IEEE Transactions on Consumer Electronics, vol.44, pp.47-52, 1994.
    • (1994) IEEE Transactions on Consumer Electronics , vol.44 , pp. 47-52
    • Kim, H.1    Im, S.2
  • 4
    • 0032070201 scopus 로고    scopus 로고
    • Analysis of shadow mask thermal deformation and prediction of beam landing shifts for color CRT
    • K.W. Kim, N.W. Kim, D.J. Kang, "Analysis of shadow mask thermal deformation and prediction of beam landing shifts for color CRT," IEEE Transactions on Consumer Electronics, vol.44, pp.442-450, 1998. (Pubitemid 128744814)
    • (1998) IEEE Transactions on Consumer Electronics , vol.44 , Issue.2 , pp. 442-450
    • Kim, K.W.1    Kim, N.W.2    Kang, D.-J.3
  • 5
    • 0032206626 scopus 로고    scopus 로고
    • Finite element analysis investigating thermal stress characteristics and weight reduction design for perfectly flat CRT
    • K.W. Kim, N.W. Kim and D.J. Kang, "Finite element analysis investigating thermal stress characteristics and weight reduction design for perfectly flat CRT," IEEE Transactions on Consumer Electronics, vol.44, pp. 1209- 1215, 1998.
    • (1998) IEEE Transactions on Consumer Electronics , vol.44 , pp. 1209-1215
    • Kim, K.W.1    Kim, N.W.2    Kang, D.J.3
  • 6
    • 0035876687 scopus 로고    scopus 로고
    • Analysis of the deformation of a perforated sheet under thermal and tension load using finite element method
    • DOI 10.1016/S0924-0136(01)00696-3, PII S0924013601006963
    • S.K. Park, J. Kim, Y.C. Chang, B.S. Kang, "Analysis of the deformation of perforated sheet under thermal and tension using finite element method," J. Mater. Process. Technol., pp.761-765, 2001, (Pubitemid 32518454)
    • (2001) Journal of Materials Processing Technology , vol.113 , Issue.1-3 , pp. 761-765
    • Park, S.-K.1    Kim, J.2    Chang, Y.-C.3    Kang, B.-S.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.