Multilayer broadside-coupled dispersive delay structures for analog signal processing

IEEE Microwave and Wireless Components Letters

Volumn 22, Issue 1, 2012, Pages 1-3

  Horii, Yasushi ^a   Gupta, Shulabh ^b   Nikfal, Babak ^b   Caloz, Christophe ^b  

^a KANSAI UNIVERSITY   (Japan)

^b POLY GRAMES RESEARCH CENTER   (Canada)

Author keywords

All pass networks; analog signal processing (ASP); dispersion engineering; dispersive delay structures (DDSs); group delay engineering; low temperature co fired ceramics (LTCC) technology

Indexed keywords

ALLPASS NETWORKS; ANALOG SIGNAL PROCESSING; DISPERSION ENGINEERING; DISPERSIVE DELAY STRUCTURES (DDSS); LOW-TEMPERATURE CO-FIRED CERAMICS;

CERAMIC MATERIALS; DISPERSION (WAVES); MULTILAYERS; SIGNAL PROCESSING;

GROUP DELAY;

EID: 84855653527     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2011.2176476     Document Type: Article

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