SCOPUS 정보 검색 플랫폼

Volumn 4, Issue 2, 2012, Pages 568-575

Pulse-reverse electrodeposition for mesoporous metal films: Combination of hydrogen evolution assisted deposition and electrochemical dealloying

(3) Cherevko, Serhiy a Kulyk, Nadiia a Chung, Chan Hwa a

a Sungkyunkwan University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ASSISTED DEPOSITION; CATHODIC CYCLE; CHARACTERISTIC SIZE; COPPER ATOMS; DEALLOYING; DIFFUSION LAYERS; DISSOLVED COPPER; EQUIVALENT SURFACE AREAS; HIGH GROWTH RATE; HYDROGEN BUBBLES; HYDROGEN EVOLUTION; MESOPOROUS METAL; MESOPOROUS PLATINUM; MODEL SYSTEM; NANOMETALS; NANOSTRUCTURED METALS; POST-TREATMENT PROCESS; PULSE-REVERSE ELECTRODEPOSITION; ROUGHNESS FACTOR; SELECTIVE DISSOLUTION; TOP-DOWN APPROACH; WAVEFORM PARAMETERS; WHOLE PROCESS;

COPPER; ELECTRODEPOSITION; METAL IONS; PLATINUM; PLATINUM ALLOYS; STOICHIOMETRY;

HYDROGEN;

ALLOY; HYDROGEN; METAL NANOPARTICLE;

ARTICLE; ARTIFICIAL MEMBRANE; CHEMISTRY; CONFORMATION; ELECTROPLATING INDUSTRY; MACROMOLECULE; MATERIALS TESTING; METHODOLOGY; PARTICLE SIZE; SURFACE PROPERTY; ULTRASTRUCTURE;

ALLOYS; ELECTROPLATING; HYDROGEN; MACROMOLECULAR SUBSTANCES; MATERIALS TESTING; MEMBRANES, ARTIFICIAL; METAL NANOPARTICLES; MOLECULAR CONFORMATION; PARTICLE SIZE; SURFACE PROPERTIES;

EID: 84855594501 PISSN: 20403364 EISSN: 20403372 Source Type: Journal
DOI: 10.1039/c1nr11503k Document Type: Article

Times cited : (40)

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