|
Volumn 409, Issue , 2012, Pages 497-501
|
Preparation of nanostructured superhydrophobic copper and aluminum surfaces
|
Author keywords
Electrochemical modifications; One step process; Scanning electron microscopy (SEM); Superhydrophobic copper and aluminum surfaces; X ray diffraction (XRD)
|
Indexed keywords
ELECTROCHEMICAL MODIFICATION;
ONE-STEP PROCESS;
SCANNING ELECTRONS;
SUPERHYDROPHOBIC;
X-RAY DIFFRACTION (XRD);
ALUMINUM;
COPPER;
COPPER METALLOGRAPHY;
ELECTRODEPOSITION;
FILM PREPARATION;
HYDROPHOBICITY;
INTERFACIAL ENERGY;
METALLIC FILMS;
NANOFIBERS;
SCANNING ELECTRON MICROSCOPY;
STEARIC ACID;
SUBSTRATES;
SURFACE CHEMISTRY;
SURFACES;
X RAY DIFFRACTION;
X RAY DIFFRACTION ANALYSIS;
ALUMINUM COATINGS;
|
EID: 84855218461
PISSN: 10226680
EISSN: None
Source Type: Book Series
DOI: 10.4028/www.scientific.net/AMR.409.497 Document Type: Conference Paper |
Times cited : (6)
|
References (14)
|