Effect of interface debonding on the thermal conductivity of microencapsulated-paraffin filled epoxy matrix composites

Composites Part A: Applied Science and Manufacturing

Volumn 43, Issue 3, 2012, Pages 325-332

  Su, Jun Feng ^a,b   Zhao, Yun Hui ^c   Wang, Xin Yu ^a   Dong, Hua ^b   Wang, Sheng Bao ^c  

^a TIANJIN UNIVERSITY OF COMMERCE   (China)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c TIANJIN UNIVERSITY   (China)

Author keywords

A. Polymer matrix composites (PMCs); B. Debonding; B. Interface; C. Micro mechanics

Indexed keywords

A. POLYMER-MATRIX COMPOSITES (PMCS); AVERAGE SIZE; C. MICRO-MECHANICS; CORE/SHELL; EPOXY-MATRIX COMPOSITE; EXPANSION COEFFICIENTS; INTERFACE BEHAVIOR; INTERFACE DEBONDING; MATRIX; MICROCAPSULES; MODELING ANALYSIS; POLYMERIC MATRICES; SHELL THICKNESS; STIRRING RATES; THERMAL SHOCK TREATMENT; THERMAL TREATMENT PROCESS;

DEBONDING; EMULSIFICATION; INTERFACES (MATERIALS); PARAFFIN WAXES; PARAFFINS; PHASE CHANGE MATERIALS; POLYMER MATRIX COMPOSITES; POLYMERS;

THERMAL CONDUCTIVITY;

EID: 84855171734     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2011.12.003     Document Type: Article

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