A rapid one-step process for fabrication of superhydrophobic surface by electrodeposition method

Electrochimica Acta

Volumn 59, Issue , 2012, Pages 168-171

  Chen, Zhi ^a   Hao, Limei ^b   Chen, Anqi ^a   Song, Qingjun ^a   Chen, Changle ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b XI'AN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Contact angle; Copper surfaces; Electrodeposition; Myristic acid; Superhydrophobic

Indexed keywords

CHEMICAL COMPOSITIONS; COPPER PLATE; COPPER SURFACES; ELECTRODEPOSITION METHODS; ELECTROLYTIC SOLUTION; FTIR; LOW SURFACE ENERGY; MICRO/NANOSTRUCTURES; MORPHOLOGICAL FEATURES; MYRISTIC ACID; NICKEL CHLORIDE; ONE-STEP PROCESS; SCANNING ELECTRON MICROSCOPY IMAGE; SUPER-HYDROPHOBIC SURFACES; SUPERHYDROPHOBIC; SUPERHYDROPHOBICITY;

CHLORINE COMPOUNDS; CONTACT ANGLE; COPPER; CRYSTAL STRUCTURE; CRYSTALS; ELECTRODEPOSITION; ETHANOL; INDUSTRIAL APPLICATIONS; SATURATED FATTY ACIDS; SCANNING ELECTRON MICROSCOPY; SURFACE CHEMISTRY; SURFACE PROPERTIES; SURFACES; X RAY DIFFRACTION;

HYDROPHOBICITY;

EID: 84655176326     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2011.10.045     Document Type: Article

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