Electroless plating of gold by using "au-amino acid" complex

Advanced Materials Research

Volumn 396-398, Issue , 2012, Pages 1914-1917

  Li, Deliang ^a   Luo, Jie ^a   Han, Lilu ^b   Peng, Yun ^a   Zhong, Diyuan ^c  

^a CENTRAL SOUTH UNIVERSITY OF FORESTRY AND TECHNOLOGY   (China)

^b Yongzhou Vocational Technical College   (China)

^c Shengzhen Rong Weiye Electronic Co Ltd   (China)

Author keywords

Cyanide free; Electroless plating; Gold amino acid complex; PCB

Indexed keywords

CHEMICAL DEPOSITION PROCESS; CYANIDE-FREE; ELECTROLESS; ORTHOGONAL EXPERIMENT; PLATING RATES; QUALITY INSPECTION;

ADHESION; AMINO ACIDS; CYANIDES; ELECTROLESS PLATING; GOLD; GOLD COATINGS; GOLD DEPOSITS; METALLURGICAL ENGINEERING; ORGANIC POLLUTANTS; POLYCHLORINATED BIPHENYLS;

GOLD COMPOUNDS;

EID: 83755225765     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.396-398.1914     Document Type: Conference Paper

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