A fast loss and temperature simulation method for power converters, part II: 3-D thermal model of power module

IEEE Transactions on Power Electronics

Volumn 27, Issue 1, 2012, Pages 258-268

  Swan, Ian ^a   Bryant, Angus ^a   Mawby, Philip A ^a   Ueta, Takashi ^b   Nishijima, Toshifumi ^b   Hamada, Kimimori ^b  

^a UNIVERSITY OF WARWICK   (United Kingdom)

^b TOYOTA MOTOR CORPORATION   (Japan)

Author keywords

FLOTHERM; Fourier series; IGBT; Modules; Packaging; Thermal model

Indexed keywords

CONVERTER MODEL; FINITE-ELEMENT; FLOTHERM; FOURIER; FOURIER-BASED MODELS; FUNCTION OF TIME; HEAT DIFFUSIONS; HEAT EQUATION; MATLAB /SIMULINK; MODULES; MULTIPLE HEAT SOURCES; NEW MODEL; POWER DEVICES; POWER MODULE; TEMPERATURE SIMULATIONS; THERMAL INTERACTION; THERMAL MODEL; THERMAL SIMULATIONS;

COMPUTATIONAL FLUID DYNAMICS; ELECTRIC POWER SYSTEMS; FINITE ELEMENT METHOD; FOURIER SERIES; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); PACKAGING; PARTIAL DIFFERENTIAL EQUATIONS; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

THREE DIMENSIONAL;

EID: 83655164762     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2011.2148730     Document Type: Article

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