Performance, power, and thermal analysis of low-power processors for scale-out systems

IEEE International Symposium on Parallel and Distributed Processing Workshops and Phd Forum

Volumn , Issue , 2011, Pages 863-870

  Stanley Marbell, Phillip ^a   Cabezas, Victoria Caparrós ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

Datacenter; Low power; Measurement; Scale out; Thermal

Indexed keywords

ACTIVE POWER; BOARD-LEVEL; COARSE-GRAINED; CURRENT MEASUREMENTS; DATA CENTERS; DATACENTER; ENERGY EFFICIENT; HARDWARE PERFORMANCE COUNTERS; HIGH-PERFORMANCE COMPUTING; LOW POWER PROCESSORS; LOW-POWER; LOW-POWER DISSIPATION; MICROBOLOMETER ARRAYS; POWER ARCHITECTURES; POWER SUPPLY; POWER-EFFICIENCY; PROCESSOR PERFORMANCE; SCALE-OUT; SEMICONDUCTOR PROCESS; SINGLE-THREADED; TARGET CLASS; THERMAL; TIMING MEASUREMENT;

COMPUTER HARDWARE; COMPUTER SOFTWARE SELECTION AND EVALUATION; DISTRIBUTED COMPUTER SYSTEMS; DISTRIBUTED PARAMETER NETWORKS; ENERGY EFFICIENCY; INFRARED IMAGING; MEASUREMENTS; PARALLEL PROCESSING SYSTEMS; THERMOANALYSIS;

ELECTRIC LOSSES;

EID: 83455171790     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPDPS.2011.225     Document Type: Conference Paper

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