Wafer cost analysis for a soft x-ray projection lithography system

Journal of X-Ray Science and Technology

Volumn 3, Issue 3, 1992, Pages 194-203

  Ceglio, N M ^a   Hawryluk, A M ^a  

^a LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 8344269308     PISSN: 08953996     EISSN: None     Source Type: Journal    
DOI: 10.3233/XST-1992-3304     Document Type: Article

References (8)

1. D. W. Berreman el at. Opt. Lett. 15, 529 (1990).
2. N. M. Ceglio et al, J. Vac. Sci. Technol. B 8, 1325 (1990).
3. J. Bokor (Ed.), “OSA Proceedings on Soft X-Ray Projection Lithography, Vol. 12,” Opt. Soc. Amer., Washington, DC, 1991.
4. N. M. Ceglio and A. M. HAWRLUK, in “OSA Proceedings on Soft X-Ray Projection Lithography” (J. Bokor, Ed.) Vol. 12, p. 5, Opt. Soc. Amer., Washington, DC, 1991; N. M. Ceglio and A. M. Hawrylljk, in “Multilayer Optics for Advanced X-ray Applications,” Proceedings ofSPIE, Vol. 1547, p. 82, SPIE, Bellingham, WA, 1991.
5. A. Wilson, Solid Slate Technol., (May 1986).
6. J. Greed, in “Proceedings, First Technical Symposium on Soft X-ray Projection Lithography” (N. M. Ceglio, Ed.), LLNL Report CONF-9001104, 1990.
7. Greed J. This result reflects the fact that the primary direct cost item is the price of the stepper.
8. See D. G. Stearns et. al., J. Appl. Phys. 67, 2415 (1990). More detailed and SXPL-specific damage investigations are underway.