Power losses evaluation for modular multilevel converter with junction temperature feedback

IEEE Power and Energy Society General Meeting

Volumn , Issue , 2011, Pages

  Tu, Qingrui ^a   Xu, Zheng ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

junction temperature feedback; modular multilevel converter; power losses

Indexed keywords

CONDUCTION LOSS; CURRENT WAVEFORMS; EVALUATION RESULTS; HEAT SINK TEMPERATURE; HVDC SYSTEMS; JUNCTION TEMPERATURES; MODULAR MULTILEVEL CONVERTERS; POWER-LOSSES; PSCAD/EMTDC; THERMAL CIRCUIT MODEL;

ELECTRIC UTILITIES; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR JUNCTIONS; TOPOLOGY;

ELECTRIC CONVERTERS;

EID: 82855181699     PISSN: 19449925     EISSN: 19449933     Source Type: Conference Proceeding    
DOI: 10.1109/PES.2011.6039038     Document Type: Conference Paper

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