Modulated laser spot welding of dissimilar copper-aluminium connections

International Conferences on Multi-Material Micro Manufacture, 4M/International Conferences on Micro Manufacturing, ICOMM

Volumn , Issue , 2009, Pages 211-214

  Weigl, M ^a   Schmidt, M ^a  

^a Bayerische Laserzentrum GmbH   (Germany)

Author keywords

Aluminium; Brittle phases; Copper; Dissimilar connections; Modulated laser welding

Indexed keywords

BASE MATERIAL; BRITTLE PHASES; CRITICAL AREA; ELECTRONIC DEVICE; JOINING TECHNOLOGY; LASER MICRO WELDING; LASER MODULATION; LASER POWER MODULATION; MIXING EFFECTS; MIXING PROCESS; MODULATED LASERS; MODULATION FACTORS; MOLTEN STATE; POWER MODULATION; TENSILE TESTS; WELDING ZONES;

ALUMINUM; BRITTLE FRACTURE; COPPER; DISSIMILAR MATERIALS; JOINING; MANUFACTURE; MODULATION; MOLTEN MATERIALS; SPOT WELDING; TENSILE TESTING; WELDING;

LASER APPLICATIONS;

EID: 82755191633     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1243/17547164C0012009040     Document Type: Conference Paper

References (3)

1. Mys, I.; Schmidt, M.; Esser, G.; Geiger, M.: Method for welding dissimilar metal joining partners, in particular, aluminium-copper connection points. Patent WO 2005/082569 A1, 2005
2. Mys, I.; Schmidt, M.: Laser micro welding of dissimilar Cu-Al materials for electronic contacts. In: Laser-based Micropackaging, Proceedings of SPIE, Vol. 6107, 2006
3. MSIT world library: Evaluation of the ternary Al- Cu-Ag system, www.matport.com, 2009