Texture evolution and flow stress of columnar-grained polycrystalline copper during intense plastic deformation process at room temperature

Materials Science and Engineering: A

Volumn 530, Issue 1, 2011, Pages 418-425

  Wang, Yu ^a   Huang, Hai You ^a   Xie, Jian Xin ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Continuous columnar grains; Flow stress; Stored energy; Texture

Indexed keywords

COPPER; STRAIN HARDENING; TEXTURES;

AVERAGE SIZE; COLUMNAR GRAIN; CONTINUOUS COLUMNAR GRAINS; DISLOCATION CELLS; LOW FLOW; POLYCRYSTALLINE COPPER; STORED ENERGY; TEXTURE COMPONENTS; TEXTURE EVOLUTIONS; WORK HARDENING RATE;

PLASTIC FLOW;

EID: 82255179261     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.09.105     Document Type: Article

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