Monitoring solder fatigue in a power module using case-above-ambient temperature rise

IEEE Transactions on Industry Applications

Volumn 47, Issue 6, 2011, Pages 2578-2591

  Xiang, Dawei ^a   Ran, Li ^a,b   Tavner, Peter ^a,b   Bryant, Angus ^c,d   Yang, Shaoyong ^c,d   Mawby, Philip ^c  

^a DURHAM UNIVERSITY   (United Kingdom)

^b CHONGQING UNIVERSITY   (China)

^c UNIVERSITY OF WARWICK   (United Kingdom)

^d GENERAL ELECTRIC COMPANY   (United States)

Author keywords

Condition monitoring; losses; power semiconductor devices; reliability; solder fatigue; thermal network

Indexed keywords

COST-EFFECTIVE MEANS; ELECTRICAL LOADING; INTERNAL THERMAL RESISTANCE; JUNCTION TEMPERATURES; MASKING EFFECT; OPERATING POINTS; POWER ELECTRONIC MODULES; POWER ELECTRONIC SYSTEMS; POWER MODULE; POWER SEMICONDUCTOR DEVICES; POWER-LOSSES; ROOT CAUSE; SOLDER FATIGUE; TEMPERATURE RISE; THERMAL MODEL; THERMAL NETWORK; TOTAL LOSS;

COMPUTER SIMULATION; HEAT RESISTANCE; LOSSES; POWER ELECTRONICS; RELIABILITY; SEMICONDUCTOR DEVICES; TEMPERATURE; TEMPERATURE MEASUREMENT;

CONDITION MONITORING;

EID: 82055168858     PISSN: 00939994     EISSN: None     Source Type: Journal    
DOI: 10.1109/TIA.2011.2168556     Document Type: Article

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