Measurement of Seebeck coefficient of electroplated thermoelectric films in presence of a seed layer

Journal of Materials Research

Volumn 26, Issue 15, 2011, Pages 1953-1957

  Nguyen, Hai P ^a   Su, Jiale ^b   Wang, Ziyang ^b   Vullers, Ruud J M ^b   Vereecken, Philippe M ^a,c   Fransaer, Jan ^a  

^a UNIVERSITY OF LEUVEN   (Belgium)

^b HOLST CENTRE   (Netherlands)

^c IMEC   (Belgium)

Author keywords

Electrodeposition; Thermally stimulated current; Thermoelectric

Indexed keywords

BULK RESISTANCE; ELECTROPLATED FILMS; FINITE ELEMENT SIMULATIONS; SEEBECK COEFFICIENT MEASUREMENT; SEED LAYER; THERMALLY STIMULATED CURRENT; THERMOELECTRIC; THERMOELECTRIC FILM;

ELECTRODEPOSITION; ELECTROPLATING; SEEBECK COEFFICIENT; SHEET RESISTANCE;

FINITE ELEMENT METHOD;

EID: 81455159246     PISSN: 08842914     EISSN: 20445326     Source Type: Journal    
DOI: 10.1557/jmr.2011.83     Document Type: Article

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