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Volumn 28, Issue 11, 2011, Pages 2206-2210
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The utilization of microencapsulated phase change material wallboards for energy saving
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Author keywords
Building Material; Latent Heat; PCM; Wallboard
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Indexed keywords
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EID: 80955163700
PISSN: 02561115
EISSN: None
Source Type: Journal
DOI: 10.1007/s11814-011-0099-0 Document Type: Article |
Times cited : (13)
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References (18)
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