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Volumn , Issue , 2011, Pages

A Virtual Metrology system for predicting CVD thickness with equipment variables and qualitative clustering

Author keywords

[No Author keywords available]

Indexed keywords

DATA CLUSTERING; DATA MINING TECHNIQUES; DATA SETS; GOOD YIELD; HIGH-QUALITY STANDARDS; SEMICONDUCTOR MANUFACTURING; VIRTUAL METROLOGY;

EID: 80655138971     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ETFA.2011.6059209     Document Type: Conference Paper
Times cited : (22)

References (7)
  • 2
    • 76849107889 scopus 로고    scopus 로고
    • Estimation and Control in Semiconductor Etch: Practice and Possibilities
    • J. Ringwood et al. Estimation and Control in Semiconductor Etch: Practice and Possibilities, IEEE Trans. on Semicon. Manuf., vol.23, (2010) 87-98.
    • (2010) IEEE Trans. on Semicon. Manuf. , vol.23 , pp. 87-98
    • Ringwood, J.1
  • 3
    • 34347398446 scopus 로고    scopus 로고
    • A Novel Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing
    • M.-H. Hung, T.-H. Lin, F.-T. Cheng, R.-C. Lin, A Novel Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing, IEEE Trans. on Mechatronics, vol.12, no.3 (2007).
    • (2007) IEEE Trans. on Mechatronics , vol.12 , Issue.3
    • Hung, M.-H.1    Lin, T.-H.2    Cheng, F.-T.3    Lin, R.-C.4
  • 4
    • 84887280274 scopus 로고
    • Run by run process control: Combining SPC and feedback control
    • E. Sachs, A. Hu, A. Ingolfsson, Run by run process control: combining SPC and feedback control, IEEE Trans. Semic. Manuf., vol. 8 (1995).
    • (1995) IEEE Trans. Semic. Manuf. , vol.8
    • Sachs, E.1    Hu, A.2    Ingolfsson, A.3
  • 5
    • 84890804322 scopus 로고    scopus 로고
    • Official Website
    • ENIAC IMPROVE, Official Website, (www.eniacimprove.eu).
    • ENIAC Improve


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.