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Volumn 19, Issue 12, 2011, Pages 2256-2266

Clock distribution networks in 3-D integrated systems

Author keywords

3 D clock characterization; 3 D clock distribution; 3 D clock modeling; 3 D synchronization

Indexed keywords

3-D CLOCK CHARACTERIZATION; 3-D CLOCK DISTRIBUTION; 3-D CLOCK MODELING; 3-D INTEGRATION; 3-D SYNCHRONIZATION; CLOCK DISTRIBUTION; CLOCK SKEWS; DESIGN ISSUES; DESIGN OBJECTIVES; FUNDAMENTAL LIMITATIONS; INTEGRATED SYSTEMS; ON-CHIP INTERCONNECTS; PERFORMANCE CRITERION; TEST CIRCUIT;

EID: 80455158008     PISSN: 10638210     EISSN: None     Source Type: Journal    
DOI: 10.1109/TVLSI.2010.2073724     Document Type: Article
Times cited : (38)

References (26)
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  • 3
    • 0032206398 scopus 로고    scopus 로고
    • Clocking design and analysis for a 600-MHz alpha microprocessor
    • PII S0018920098070437
    • W. Bailey and B. J. Benschneider, "Clocking design and analysis for a 600-MHz alpha microprocessor," IEEE J. Solid-State Circuits, vol. 22, no. 11, pp. 1627-1633, Nov. 1998. (Pubitemid 128600337)
    • (1998) IEEE Journal of Solid-State Circuits , vol.33 , Issue.11 , pp. 1627-1633
    • Bailey, D.W.1    Benschneider, B.J.2
  • 8
    • 39749198344 scopus 로고    scopus 로고
    • A scan-island based design enabling pre-bond testability in die-stacked microprocessor
    • D. L. Lewis and H.-H. S. Lee, "A scan-island based design enabling pre-bond testability in die-stacked microprocessor," in Proc. IEEE Int. Test Conf., 2007, pp. 21.2.1-21.2.8.
    • (2007) Proc. IEEE Int. Test Conf. , pp. 2121-2128
    • Lewis, D.L.1    Lee, H.-H.S.2
  • 21
    • 33845567960 scopus 로고    scopus 로고
    • Fabrication of high aspect ratio 35 μm pitch interconnects for next generation 3-D wafer level packaging by through-wafer copper electroplating
    • DOI 10.1109/ECTC.2006.1645675, 1645675, Proceedings - IEEE 56th Electronic Components and Technology Conference
    • P. Dixit and J. Miao, "Fabrication of high aspect ratio 35 m pitch interconnects for next generation 3-D wafer level packaging by throughwafer copper electroplating," in Proc. IEEE Int. Electron. Components Technol. Conf., 2006, pp. 388-393. (Pubitemid 44929705)
    • (2006) Proceedings - Electronic Components and Technology Conference , vol.2006 , pp. 388-393
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  • 26
    • 69549108427 scopus 로고    scopus 로고
    • Closed-form expressions of 3-D via resistance, inductance, and capacitance
    • Sep.
    • I. Savidis and E. G. Friedman, "Closed-form expressions of 3-D via resistance, inductance, and capacitance," IEEE Trans. Electron Devices, vol. 56, no. 9, pp. 1873-1881, Sep. 2009.
    • (2009) IEEE Trans. Electron Devices , vol.56 , Issue.9 , pp. 1873-1881
    • Savidis, I.1    Friedman, E.G.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.