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Volumn 56, Issue 27, 2011, Pages 10083-10092

Influence of the substrate's surface structure on the mechanism and kinetics of the electrochemical UPD formation of a copper monolayer on gold

Author keywords

Au(1 1 1); Copper; Electrodeposition; Polycrystalline gold; UPD

Indexed keywords

2D NUCLEATION; ADSORPTION PROCESS; AU(1 1 1 ); COPPER ELECTRODEPOSITION; CRYSTALLINITIES; ELECTROCHEMICAL TECHNIQUES; GOLD ELECTRODES; GOLD SUBSTRATES; MECHANISM AND KINETICS; POLYCRYSTALLINE; POLYCRYSTALLINE GOLD; POTENTIOSTATICS; UPD;

EID: 80054937454     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2011.08.105     Document Type: Article
Times cited : (29)

References (37)
  • 2
    • 80054938635 scopus 로고
    • Schering Research Foundation Berlin
    • D.M. Kolb Schering Lecture's Publication vol. 2, issue no. 1 1991 Schering Research Foundation Berlin
    • (1991) Schering Lecture's Publication , vol.2 , Issue.1
    • Kolb, D.M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.