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Volumn 56, Issue 27, 2011, Pages 10083-10092
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Influence of the substrate's surface structure on the mechanism and kinetics of the electrochemical UPD formation of a copper monolayer on gold
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Author keywords
Au(1 1 1); Copper; Electrodeposition; Polycrystalline gold; UPD
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Indexed keywords
2D NUCLEATION;
ADSORPTION PROCESS;
AU(1 1 1 );
COPPER ELECTRODEPOSITION;
CRYSTALLINITIES;
ELECTROCHEMICAL TECHNIQUES;
GOLD ELECTRODES;
GOLD SUBSTRATES;
MECHANISM AND KINETICS;
POLYCRYSTALLINE;
POLYCRYSTALLINE GOLD;
POTENTIOSTATICS;
UPD;
ADSORPTION;
CRYSTAL STRUCTURE;
ELECTRODEPOSITION;
GOLD;
MONOLAYERS;
POWER QUALITY;
SINGLE CRYSTALS;
SUBSTRATES;
SURFACE STRUCTURE;
COPPER;
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EID: 80054937454
PISSN: 00134686
EISSN: None
Source Type: Journal
DOI: 10.1016/j.electacta.2011.08.105 Document Type: Article |
Times cited : (29)
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References (37)
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