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Volumn 72, Issue 4, 2011, Pages 748-754
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Copper/polypyrrole multilayer coating for 7075 aluminum alloy protection
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Author keywords
FT IR; Polypyrrole; SEM; TGA
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Indexed keywords
3.5%NACL;
7075 ALUMINUM ALLOY;
ANODIC POLARIZATION CURVES;
BARRIER EFFECTS;
COPPER SULPHATE;
CORROSION BEHAVIOR;
CORROSIVE ENVIRONMENT;
CU LAYERS;
ELECTROLESS METHODS;
FT-IR;
MULTI-LAYER-COATING;
OXALIC ACID SOLUTION;
PPY FILMS;
TGA;
ALUMINUM;
ATOMIC FORCE MICROSCOPY;
CERIUM ALLOYS;
COPPER;
COPPER PLATING;
CORROSION RESISTANCE;
CORROSIVE EFFECTS;
CYCLIC VOLTAMMETRY;
ELECTROCHEMICAL CORROSION;
ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY;
FOURIER TRANSFORM INFRARED SPECTROSCOPY;
INVESTMENTS;
ORGANIC ACIDS;
POLYPYRROLES;
SCANNING ELECTRON MICROSCOPY;
SODIUM CHLORIDE;
THERMODYNAMIC STABILITY;
THERMOGRAVIMETRIC ANALYSIS;
ALUMINUM COATINGS;
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EID: 80054923006
PISSN: 03009440
EISSN: None
Source Type: Journal
DOI: 10.1016/j.porgcoat.2011.08.006 Document Type: Article |
Times cited : (38)
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References (44)
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