Unusually large magnetic anisotropy in electrochemically deposited co-rich co-pt films

ACS Applied Materials and Interfaces

Volumn 3, Issue 6, 2011, Pages 1800-1803

  Sirtori, V ^a   Cavallotti, P L ^a   Rognoni, R ^b   Xu, X ^c,e   Zangari, G ^c   Fratesi, G ^d   Trioni, M I ^d,f   Bernasconi, M ^d  

^a POLITECNICO DI MILANO   (Italy)

^b SEM srl Services for Electronic Manufacturing   (Italy)

^c University of Virginia   (United States)

^d UNIVERSITY OF MILANO BICOCCA   (Italy)

^e SEAGATE TECHNOLOGY   (United States)

^f CNR Consiglio Nazionale delle Ricerche   (Italy)

Author keywords

Co Pt; Density functional theory; Electrodeposition of alloys; Electronic structure calculations; Hard magnetic films; Magnetic anisotropy; XPS valence band

Indexed keywords

AU (111) SUBSTRATES; BULK MATERIALS; CO-PT; DENSITY FUNCTIONAL THEORY SIMULATIONS; DENSITY FUNCTIONALS; ELECTRODEPOSITED FILMS; ELECTRONIC STRUCTURE CALCULATIONS; HARD MAGNETIC FILM; HEXAGONAL STRUCTURES; HIGH ANISOTROPY; HIGH TEMPERATURE; PERPENDICULAR MAGNETIC ANISOTROPY; SHAPE ANISOTROPY; VACUUM METHOD;

COBALT; DENSITY FUNCTIONAL THEORY; ELECTRODEPOSITION; ELECTRONIC PROPERTIES; ELECTRONIC STRUCTURE; FILMS; GOLD; GOLD COATINGS; MAGNETIC LOGIC DEVICES; PHOTOELECTRON SPECTROSCOPY; PLATINUM; VACUUM APPLICATIONS; X RAY PHOTOELECTRON SPECTROSCOPY;

MAGNETIC ANISOTROPY;

COBALT; PLATINUM;

ANISOTROPY; ARTICLE; CHEMISTRY; ELECTROCHEMISTRY; MAGNETISM; METHODOLOGY;

ANISOTROPY; COBALT; ELECTROCHEMISTRY; MAGNETICS; PLATINUM;

EID: 80054792602     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am200267u     Document Type: Article

References (20)

1. Harp, G. R.; Weller, D.; Rabedeau, T. A.; Farrow, R. F. C.; Toney, M. F. Phys. Rev. Lett. 1993, 71, 2493-2496.
2. Maret, M.; Cadeville, M. C.; Herr, A.; Poinsot, R.; Beaurepaire, E.; Lefebvre, S.; Bessière, M. J. Magn. Magn. Mater. 1999, 191, 61-71.
3. Yamada, Y.; Suzuki, T.; Kanazawa, H.; Österman, J. C. J. Appl. Phys. 1999, 85, 5094-5096.
4. Marković, N. M.; Ross, P. N., Jr. Surf. Sci. Rep. 2002, 45, 117-229.
5. De Santis, M.; Baudoing-Savois, R.; Dolle, P.; Saint-Lager, M. C. Phys. Rev. B 2002, 66, 085412.
6. Yamada, Y.; Suzuki, T.; Abarra, E. N. IEEE Trans. Magn. 1997, 33, 3622-3624.
7. Yamada, Y.; Suzuki, T.; Abarra, E. N. IEEE Trans. Magn. 1998, 34, 343-345.
8. Klemmer, T.; Hoydick, D.; Okumura, H.; Zhang, B.; Soffa, W. A. Scripta Metall. Mater. 1995, 33, 1793-1805.
9. Zangari, G. Micro-electromechanical systems. In Modern Electroplating; Schlesinger, M., Ed.; Wiley: New York, 2010; Chapter 28.
10. Pattanaik, G.; Kirkwood, D. M.; Xu, X.; Zangari, G. Electrochim. Acta 2007, 52, 2755-2764.
11. Pattanaik, G.; Zangari, G.; Weston, J. Appl. Phys. Lett. 2006, 89, 112506.
12. Zana, I.; Zangari, G.; Shamsuzzoha, M. J. Magn. Magn. Mater. 2005, 292, 266-280.
13. Bolzoni, F.; Leccabue, F.; Panizzieri, R.; Pareti, L. IEEE Trans. Magn. 1984, 20, 1625-1627.
14. Willoughby, S. D.; Stern, R. A.; Duplessis, R. R.; MacLaren, J. M.; McHenry, M. E.; Laughlin, D. E. J. Appl. Phys. 2003, 93, 7145-7147.
15. MacLaren, J. M.; Duplessis, R. R.; Stern, R. A.; Willoughby, S. D. IEEE Trans. Magn. 2005, 41, 4374-4379.
16. Vanderbilt, D. Phys. Rev. B 1990, 41, 7892-7895.
17. Perdew, J. P.; Burke, K.; Erznerhof, M. Phys. Rev. Lett. 1996, 77, 3865.
18. Giannozzi, P.; Baroni, S.; Bonini, N.; Calandara, M.; Car, R.; Cavazzoni, C.; Ceresoli, D.; Chiarotti, G. L.; Cococcioni, M.; Dabo, I.; Corso, A. D.; de Gironcoli, S.; Fabris, S.; Fratesi, G.; Gebauer, R.; Gerstmann, U.; Gougoussis, C.; Kokalj, A.; Lazzeri, M.; Martin-Samos, L.; Marzari, N.; Mauri, F.; Mazzarello, R.; Paolini, S.; Pasquarello, A.; Paulatto, L.; Sbraccia, C.; Scandolo, S.; Sclauzero, G.; Seitsonen, A. P.; Smogunov, A.; Umari, P.; Wentzcovitch, R. M. J. Phys. Chem. B 2006, 110, 23489-23496.
19. Lee, Y.-S.; Lim, K.-Y.; Chung, Y.-D.; Whang, C.-N.; Jeon, Y. Surf. Interface Anal. 2000, 30, 475-478.
20. Wakisaka, M.; Mitsui, S.; Hirose, Y.; Kawashima, K.; Uchida, H.; Watanabe, M. J. Phys. Chem. B 2006, 110, 23489-23496.