Air-stable silver-coated copper particles of sub-micrometer size

Journal of Colloid and Interface Science

Volumn 364, Issue 2, 2011, Pages 574-581

  Jung, D S ^a   Lee, H M ^b   Kang, Y C ^c   Park, S B ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Korea Institute of Material Science   (South Korea)

^c Konkuk University   (South Korea)

Author keywords

Air stability; Coating; Conductive film; Copper particles; Spray pyrolysis

Indexed keywords

AIR STABILITY; AIR-STABLE; COATED PARTICLES; CONVERSION PROCESS; COPPER PARTICLES; CORE SHELL STRUCTURE; ELECTRICAL PROPERTY; FORMATION MECHANISM; LOW RESISTANCE; LOW SINTERING TEMPERATURE; MEAN DIAMETER; METALLIC COPPER; OXIDE LAYER; PYROLYSIS REACTOR; RESIDENCE TIME; SILVER LAYER; SILVER LOADING; SUBMICROMETERS;

CHEMICAL REACTORS; COPPER; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; FILM PREPARATION; SINTERING; SPRAY PYROLYSIS;

SILVER;

COPPER DERIVATIVE; CUPRIC OXIDE; OXYGEN; SILVER;

AIR; ARTICLE; CRYSTAL STRUCTURE; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; ELECTRICAL CONDUCTIVITY PARAMETERS; LIQUID; LOW TEMPERATURE; MATERIAL COATING; NONHUMAN; OXIDATION; PARTICLE SIZE; PRIORITY JOURNAL; PYROLYSIS; SURFACE TENSION; THERMAL ANALYSIS; THERMOGRAVIMETRY;

EID: 80054693811     PISSN: 00219797     EISSN: 10957103     Source Type: Journal    
DOI: 10.1016/j.jcis.2011.08.033     Document Type: Article

References (34)

1. Kapolnek D., De Jonghe L.C. J. Eur. Ceram. Soc. 1991, 7:345.
2. Sugimoto T., Zhou X., Muramatsu A. J. Colloid Interface Sci. 2003, 259:43.
3. Lee K.R., Kim S.J., Song J.S., Lee J.H., Chung Y.J., Park S. J. Am. Ceram. Soc. 2002, 85:341.
4. Yang J., Mei S., Ferreira J.M. J. Am. Ceram. Soc. 2001, 84:1696.
5. Wang G., Li G. Eur. Phys. J. D 2003, 24:355.
6. Landfester K. Adv. Mater. 2001, 13:765.
7. Kim J., Wilhelm O., Pratsinis S.E. Adv. Mater. 2002, 13:494.
8. Jung D.S., Park S.B., Kang Y.C. Korean J. Chem. Eng. 2010, 27(6):1621.
9. Strobel R., Pratsinis S.E. J. Mater. Chem. 2007, 17:4743.
10. Fotou G.P., Kodas T.T. Adv. Mater. 1997, 9:420.
11. Jain S., Fotou G.P., Kodas T.T. J. Colloid Interface Sci. 1997, 185:26.
12. powell Q.H., Fotou G.P., Kodas T.T. Chem. Mater. 1997, 9:685.
13. Jain S., Kodas T.T. J. Electrochem. Soc. 1997, 144:1222.
14. Borland W. Electronic Materials Handbook 1989, vol. 334. ASM International, OH.
15. Majumdar D., Glicksman H.D., Kodas T.T. Powder Technol. 2000, 110:76.
16. Grouchko M., Kamyshny A., Magdassi S. J. Mater. Chem. 2009, 19:3057.
17. Wu S.P. Mater. Lett. 2007, 61:1125.
18. Pollet M., Marinel S. J. Mater. Sci. 2004, 39:1943.
19. Jeong S.H., Woo K.H., Kim D.K., Lim S.K., Kim J.S., Shin H.J., Xia Y., Moon J.H. Adv. Funct. Mater. 2008, 18:679.
20. Guo Y.H., Jiang B.B., Chen J.Z., Zhang S.J. Surf. Coat. Technol. 2007, 202:555.
21. Guo Y.H., Yu X.B., Chen J.Z. Corros. Sci. 2009, 51:1573.
22. Seshadri R., Sen R., Subbanna G.N., Kannan K.R., Rao C.N.R. Chem. Phys. Lett. 1994, 231:308.
23. Kanninen P., Johans C., Merta J., Kontturi K. J. Coll. Int. Sci. 2008, 318:88.
24. Shpaisman N., Margel S. Chem. Mater. 2006, 18:396.
25. Fu W., Yang H., Chang L., Li M., Bala H., Yu Q., Zou G. Colloids Surf. A. 2005, 262:71.
26. Aslam M., Li S., Dravid V.P. J. Am. Ceram. Soc. 2007, 90:950.
27. Xu X., Luo X., Zhuang H., Li W., Zhang B. Mater. Lett. 2003, 57:3987.
28. Ogihara T., Ookura T., Yanagawa T., Ogata N., Yoshida K. J. Mater. Chem. 1991, 2:789.
29. Nagashima K., Wada M., Kato A. J. Mater. Res. 1990, 5:2828.
30. Rang R.J. J. Acoust. Soc. Am. 1962, 34:6.
31. Majumdar D., Kodas T.T., Glicksman H.D. Adv. Mater. 1996, 8:1020.
32. Yang S.Y., Kim S.G. Powder Technol. 2004, 146:185.
33. Pingali K.C., Deng S., Rockstraw D.A. Powder Technol. 2008, 183:282.
34. Norton M.G. J. Mater. Sci. 1984, 19:777.