Mechanical and thermal properties of epoxy based composites with poss modified carbon nanotubes

International SAMPE Technical Conference

Volumn , Issue , 2007, Pages

  Jones, Wanda D ^a   Rangari, Vijaya K ^a   Jeelani, Shaik ^a  

^a TUSKEGEE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSOLUTE ETHANOLS; ASTM STANDARDS; COMPRESSION TESTS; CURING AGENTS; DISCHARGE PROPERTIES; DOUBLE DISTILLED WATERS; DYNAMIC MECHANICALS; HIGH STRENGTHS; HIGH-INTENSITY ULTRASONIC; HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPES; IN-SITU POLYMERIZATIONS; INTERFACIAL BONDINGS; LOW WEIGHTS; MATRIXES; MECHANICAL AND THERMAL PROPERTIES; MULTI-WALLED CARBON NANOTUBES; NANO-REINFORCEMENTS; POLYMER RESINS; POLYMER-BASED COMPOSITES; REACTION PRODUCTS; REINFORCEMENT MATERIALS; SILSESQUIOXANE; SONOCHEMICAL METHODS; ULTRASOUND IRRADIATIONS;

CARBON CARBON COMPOSITES; CARBON FIBER REINFORCED PLASTICS; CHEMICAL MODIFICATION; COMPRESSION TESTING; CURING; DISPERSIONS; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; ELECTROSTATIC DEVICES; EPOXY RESINS; ETHANOL; INDUSTRIAL APPLICATIONS; MECHANICAL PROPERTIES; MULTIWALLED CARBON NANOTUBES (MWCN); NANOCOMPOSITES; NANOPARTICLES; NANOTUBES; POLYMER MATRIX COMPOSITES; POLYMERS; REINFORCEMENT; RESINS; SONOCHEMISTRY; THERMODYNAMIC PROPERTIES; THERMOGRAVIMETRIC ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY; ULTRASONICS; WIRELESS TELECOMMUNICATION SYSTEMS;

CARBON NANOTUBES;

EID: 80053844121     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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