-
1
-
-
44849104314
-
Exploration of power device reliability using compact device models and fast electrothermal simulation
-
MAY/JUNE
-
A. T. Bryant, P. A. Mawby, and P. R. Palmer, "Exploration of power device reliability using compact device models and fast electrothermal simulation," IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, vol. 44, no. 3, pp. 894-903, MAY/JUNE 2008.
-
(2008)
IEEE Transactions on Industry Applications
, vol.44
, Issue.3
, pp. 894-903
-
-
Bryant, A.T.1
Mawby, P.A.2
Palmer, P.R.3
-
2
-
-
72449168432
-
An industry-based survey of reliability in power electronic converters
-
S. Yang, A. T. Bryant, P. A. Mawby, D. Xiang, L. Ran, and P. Tavner, "An industry-based survey of reliability in power electronic converters," in ECCE, San Jose, USA, 2009.
-
ECCE, San Jose, USA, 2009
-
-
Yang, S.1
Bryant, A.T.2
Mawby, P.A.3
Xiang, D.4
Ran, L.5
Tavner, P.6
-
3
-
-
0033904050
-
Solder joint fatigue models: Review and applicability to chip scale packages
-
W. W. Lee, L. T. Nguyen, and G. S. Selvaduray, "Solder joint fatigue models: review and applicability to chip scale packages," Microelectronics Reliability, vol. 40, pp. 231-244, 2000.
-
(2000)
Microelectronics Reliability
, vol.40
, pp. 231-244
-
-
Lee, W.W.1
Nguyen, L.T.2
Selvaduray, G.S.3
-
4
-
-
4944221172
-
A novel electro-thermal simulation approach of power igbt modules for automotive traction applications
-
T. Kojima, Y. Yamada, M. Ciappa, M. Chiavarini, and W. Fichtner, "A novel electro-thermal simulation approach of power igbt modules for automotive traction applications," in in Proc. ISPSD, Kitakyushu, Japan, 2004, pp. 289-292.
-
Proc. ISPSD, Kitakyushu, Japan, 2004
, pp. 289-292
-
-
Kojima, T.1
Yamada, Y.2
Ciappa, M.3
Chiavarini, M.4
Fichtner, W.5
-
5
-
-
80053482342
-
A dynamic electro-thermal model for the igbt
-
Mar./Apr.
-
A. R. Hefner, "A dynamic electro-thermal model for the igbt," IEEE Trans. Ind. Appl., vol. 30, no. 2, p. 394405, Mar./Apr. 1994.
-
(1994)
IEEE Trans. Ind. Appl.
, vol.30
, Issue.2
, pp. 394405
-
-
Hefner, A.R.1
-
6
-
-
0141787901
-
Circuit simulator models for the diode and igbt with full temperature dependent features
-
Sep.
-
P. R. Palmer, E. Santi, J. L. Hudgins, X. Kang, J. C. Joyce, and P. Y. Eng, "Circuit simulator models for the diode and igbt with full temperature dependent features," IEEE Trans. Power Electron., vol. 18, no. 5, pp. 1220-1229, Sep. 2003.
-
(2003)
IEEE Trans. Power Electron.
, vol.18
, Issue.5
, pp. 1220-1229
-
-
Palmer, P.R.1
Santi, E.2
Hudgins, J.L.3
Kang, X.4
Joyce, J.C.5
Eng, P.Y.6
-
7
-
-
0141643281
-
Characterization and modeling of high-voltage field-stop igbts
-
Jul./Aug
-
X. Kang, A. Caiafa, E. Santi, J. L. Hudgins, and P. R. Palmer, "Characterization and modeling of high-voltage field-stop igbts," IEEE Trans. Ind. Appl., vol. 39, no. 4, pp. 922-928, Jul./Aug 2003.
-
(2003)
IEEE Trans. Ind. Appl.
, vol.39
, Issue.4
, pp. 922-928
-
-
Kang, X.1
Caiafa, A.2
Santi, E.3
Hudgins, J.L.4
Palmer, P.R.5
-
8
-
-
33644910694
-
Two-step parameter extraction procedure with formal optimization for physics-based circuit simulator IGBT and p-i-n diode models
-
DOI 10.1109/TPEL.2005.869742
-
A. T. Bryant, X. Kang, E. Santi, P. R. Palmer, and J. L. Hudgins, "Two-step parameter extraction procedure with formal optimization for physics-based circuit simulator igbt and p-i-n diode models," IEEE transactions on power electronics, vol. 21, no. 2, pp. 295-309, Mar. 2006. (Pubitemid 43380078)
-
(2006)
IEEE Transactions on Power Electronics
, vol.21
, Issue.2
, pp. 295-309
-
-
Bryant, A.T.1
Kang, X.2
Santi, E.3
Palmer, P.R.4
Hudgins, J.L.5
-
9
-
-
0032083619
-
On the effect of power cycling stress on IGBT modules
-
PII S002627149800081X
-
P. Cova and F. Fantini, "On the effect of power cycling stress on igbt modules," Microelectronics Reliability, vol. 38, pp. 1347-1352, 1998. (Pubitemid 128634030)
-
(1998)
Microelectronics Reliability
, vol.38
, Issue.6-8
, pp. 1347-1352
-
-
Cova, P.1
Fantini, F.2
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